Double-Sided Polyimide Tape

Double-Sided Polyimide Tape K-630 is a high-temp silicone adhesive PI tape for FPC bonding, insulation lamination, and reflow-related assembly. Suitable for die-cut converting, custom slitting, and high-temperature electronic manufacturing.

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SKU: K-630 Category:

Double-Sided Polyimide Tape (K-630)

Double-Sided Polyimide Tape (Silicone PSA) | High-Temp Bonding & Thermal Stability

Double Coated Polyimide Tape for FPC Bonding, Electrical Insulation Lamination, and Reflow-Related Assembly Processes

Double-Sided Polyimide Tape (also called double sided polyimide tape, double sided Kapton tape, or double coated PI tape) uses a polyimide (PI) film carrier coated with high-temperature silicone pressure-sensitive adhesive (PSA) on both sides, typically supplied with a PET fluorine release liner for clean handling and converting.

It is ideal for high-temperature bonding and electrical insulation lamination in electronics manufacturing—especially where conventional PSA tapes may soften, creep, or lose dielectric margin during reflow, thermal curing, or elevated-temperature service.

Double-Sided Polyimide Tape structure

 

Key Features & Benefits

High-temp bonding performance with silicone PSA on both sides for stable adhesion in demanding thermal processes

Thermal stability for demanding high-temperature bonding processes. Temperature suitability depends on construction, peak temperature, dwell time, and process conditions. Please confirm the exact grade with the official TDS.

Electrical insulation: high dielectric performance enabled by PI carrier + construction thickness options

Converting-ready: available in multiple constructions, widths, and die-cut formats

 

Typical Applications

Selected FPC and Electronic Assembly

  • FPC/FFC positioning, fixation and selected bonding applications;
  • Attachment of small components, spacers, insulation layers and assembly aids;
  • Temporary or semi-permanent fixation during reflow, thermal curing or other elevated-temperature processes;
  • Die-cut mounting parts for electronic assemblies where a thin, heat-stable carrier is required.

FPC-to-rigid bonding should be qualified for the actual substrate, bending requirement, thermal cycling, adhesive flow and long-term holding force. K-630 should not be treated as a replacement for FPC laminating adhesive, conductive adhesive or ACF unless the specific construction has been validated for that purpose.

Electrical Insulation Lamination

  • Layer-to-layer insulation fixation;
  • Splicing and positioning of insulation materials;
  • Bonding of insulation films, spacers and protective layers;
  • High-temperature electrical assembly where dielectric separation and dimensional stability are required.

For insulation layer selection and construction design, see our  Electrical Insulation guide. Dielectric breakdown, insulation resistance, adhesive aging and compatibility with the complete insulation system should be confirmed before production approval.

Double-sided polyimide tape is mainly selected for high-temperature fixation, insulation-layer bonding and die-cut mounting parts. Powder coating, PCB solder masking, EV battery insulation and ESD-sensitive masking should be evaluated as separate application categories and should not be treated as standard uses of K-630 without application-specific test data.

 

Engineering Insight: Common Failure Modes in High-Temp Bonding (and How to Avoid Them)

This is where most double-sided tape projects succeed or fail—especially in FPC-to-rigid bonding:

Edge lift / delamination after reflow

  • Why it happens: Thermal expansion mismatch (CTE) and repeated thermal cycling create shear stress at the bondline.
  • How to prevent it: Select construction based on peak temperature + dwell time + cycle count; consider thicker constructions for higher dielectric margin and robustness; validate on actual substrates.

Adhesive ooze-out / contamination

  • Why it happens: High heat + lamination pressure + long dwell times can cause adhesive flow at edges, especially on low surface-energy surfaces.
  • How to prevent it: Control lamination pressure, avoid overhang, define residue tolerance, and run a short trial to confirm performance.

Liner handling issues

  • Why it happens: Inconsistent liner release can cause stretching, misalignment, or adhesive lift—common in automated placement.
  • How to prevent it: Choose the right liner type and define target liner behavior.Custom liner release options available based on application needs. Contact us for more details.

Technical Specifications

Typical values shown below are for reference only. Please request the official TDS for grade-specific values, test conditions, and qualification requirements.

Item No.PI Film (mm)Liner (mm)Total (mm)Adhesion to Steel (N/25mm)Tensile Strength (kgf/25 mm)Elongation (%)Heat Resistance (°C)Dielectric Breakdown (kV)
K-630-100.0250.050.105.010452605
K-630-150.050.050.155.520502607
K-630-200.0750.050.205.520552609

Notes :

Adhesion to steel is shown as a single value per construction. If your process requires differential adhesion , ask us—some constructions can be designed with asymmetric adhesive systems.

Typical test methods may include ASTM D3330 for peel adhesion, ASTM D3759 for tensile strength and elongation, and ASTM D149 for dielectric breakdown.

How to Choose

  • Choose 0.10mm when you need thin bondline, higher conformability, and precision placement (tight tolerances).
  • Choose 0.15–0.20mm when you need better handling, higher robustness, and more dielectric margin for high-voltage insulation builds.
  • For reflow/curing lines, always select by peak temperature + dwell time + cycle count, not temperature alone.

Converting & Customization

  • Widths: 5 mm to 500 mm; custom slitting available
  • Standard roll length: 33 m; custom lengths available
  • Liner: PET fluorine release liner; single/double liner options by request
  • Converting: rolls, sheets, log/jumbo rolls, and die-cut parts (dots, discs, custom shapes)
  • OEM/ODM: production based on samples and drawings

Quality, Documentation & Traceability

We support procurement and engineering approval with:

TDS  and application guidance.

Downloads

Download TDS (PDF)
View All Datasheets

 

Storage & Shelf Life

Store in the original packaging in a clean, dry area away from direct sunlight and heat sources. Recommended storage conditions should be confirmed for the exact grade. Please request the official TDS or product specification for storage and shelf-life details.

Double-Sided Polyimide Tape applications

 

Need custom widths, wholesale rolls, or factory-direct supply?

Learn more about our Polyimide Tape Manufacturer capability for PCB masking, FPC assembly, and electrical insulation.

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FAQ

What is double sided polyimide tape used for?

High-temperature bonding, insulation lamination, FPC fixation, and assembly splicing where PI film stability and silicone PSA heat performance are required.

What temperature can double sided Kapton tape handle?

Many constructions are specified for continuous use up to 260°C, with short-term peaks up to ~280°C depending on dwell time and construction. Always qualify using your real peak temperature + dwell time + cycles.

How do I choose thickness for FPC-to-rigid bonding?

Use thinner constructions for precision placement and conformability; use thicker constructions for improved robustness and dielectric margin. Thermal cycling stress (CTE mismatch) should be considered in qualification.

How do I specify liner release behavior for manual vs automated application?

For automation, stable liner release is critical to avoid stretching or adhesive lift. Specify your liner preference and application method. Liner release force data is available upon request for selected constructions and liner types.

 

Ready to qualify Double sided Polyimide Tape on your line?

Request a quote or samples with your required thickness, width, roll format, and operating temperature profile. Our team will recommend the optimal grade and converting option for your application.

 

Buying Guides – All product selection guides
Comparison Articles – Product comparisons and feature analysis
Troubleshooting – Common issues and solutions

Backing material

Polyimide film

Adhesive type

Silicone (PSA)

Construction

Double-sided

Color

Amber/Brown

Total thickness

0.10/0.15/0.20mm

Elongation at Break

45%/50%/55%

Tensile Strength

10/20N/10mm

Adhesion to steel

5.0N/5.5N/25mm

Temperature Resistance

260°C

Dielectric Breakdown

5.0/7.0/9.0KV

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