ESD Polyimide Tape

ESD Polyimide Tape (K-640)

ESD Polyimide Tape (ESD Kapton®-Type Tape) | High-Temp Masking with Static-Dissipative Control

Anti-Static Polyimide Film Tape for PCB Gold Finger Masking, Wave Solder / Reflow Protection & ESD-Sensitive Assembly

ESD Polyimide Tape (also known as ESD Kapton tape or anti-static Kapton tape) is an anti-static treated polyimide film coated with a high-performance silicone pressure-sensitive adhesive (PSA). Unlike standard polyimide tape, ESD grades are designed to reduce tribocharging during unwind, masking, and removal—helping lower the risk of ESD events on sensitive devices.

Typical ESD polyimide tapes are specified with surface resistance in the electrostatic-dissipative range (commonly around 10^6–10^9 Ω depending on grade) and are widely used in SMT/semiconductor workflows, PCB masking, and other heat-intensive processes.

Key Features & Benefits

Static-dissipative surface resistance: commonly specified in ranges such as 10^6–10^9 Ω (grade-dependent), helping reduce static accumulation during tape handling.

High-temperature process suitability: ESD polyimide tapes are commonly used in wave solder, reflow, and other high-temperature masking processes. Final suitability depends on peak temperature, dwell time, cycles, and process chemistry, and should be confirmed with the TDS for the exact grade.

Low peel-charge / low electrostatic voltage claims are commonly provided for ESD grades.

High dielectric insulation + PI film stability for masking accuracy and protection in high-heat steps.

Converting-ready: available in multiple thicknesses, widths, and custom die-cut formats for production lines.

Typical Applications

Electronics & PCB Assembly

• PCB gold finger masking and protection during wave solder and reflow steps
• Selective masking for conformal coating / sensitive areas in SMT lines (where static control is required)

Semiconductor / ESD-Sensitive Assembly

Masking and temporary protection where low tribocharging during peel/unwind is important (grade qualification recommended)

PCB, Semiconductor & ESD-Sensitive Assembly
Low-static masking and temporary protection in PCB, semiconductor, and other ESD-sensitive assembly workflows where reduced tribocharging during unwind and removal is important.
Gold finger masking, wave solder masking, and selected reflow-related protection where both heat resistance and static-dissipative surface behavior are required.

ESD Kapton tape is suitable for static-sensitive SMT and electronic manufacturing processes where high-temperature masking and electrostatic control are required. For process selection, see our ESD-Safe Masking for SMT & Semiconductor guide. For wave soldering, reflow protection, or localized PCB masking, review our PCB solder masking guide before approval.

Engineering Insight: Common ESD Masking Failures (and How to Prevent Them)

High peel-charge during tape removal → ESD risk

• Why it happens: triboelectric charging varies with film treatment, adhesive surface, peel speed/angle, humidity, and grounding.
• How to prevent it: define your target surface resistance range and (if required) peel/unwind voltage; control peel speed, maintain adequate humidity, and ensure proper grounding/EPA procedures.

Adhesive transfer after high heat exposure

• Why it happens: longer dwell times at elevated temperatures can increase residue risk on certain substrates.
• How to prevent it: qualify by real peak temperature + dwell time, and validate residue tolerance by sample trial.

Mask edge lift / leakage during wave solder or coating

• Why it happens: insufficient surface prep, poor conformability for fine features, or wrong thickness selection.
• How to prevent it: choose an appropriate thickness (thin for fine gold fingers; thicker for robustness), and apply firm pressure on clean, dry surfaces.

Technical Specifications

Static performance is grade-dependent. If your process requires defined low-static performance during unwind or removal, please request grade-specific static discharge or peel-voltage data.

Industry Test Standards

To ensure reliable performance in electronics manufacturing environments, ESD Polyimide Tape is tested according to internationally recognized standards:

• Peel Adhesion: ASTM D3330
• Tensile Strength & Elongation: ASTM D3759
• Surface Resistivity: ASTM D257
• Dielectric Breakdown Voltage: ASTM D149
• Total Thickness: ASTM D3652

These standards are widely used in the electrical insulation and ESD-control materials industry.

How to Choose (ESD vs Standard Polyimide Tape)

Choose ESD polyimide tape when you need static-dissipative surface behavior (surface resistance targets such as 10^6–10^9 Ω) to help reduce tribocharging risk in ESD-sensitive workflows.

Choose standard polyimide tape when ESD control is not required and you only need high-temperature masking/insulation.

Quick thickness guidance:

• Choose 0.06 mm for finer masking features (e.g., gold fingers) and better conformability.
• Choose 0.08 mm for increased robustness and handling.

Converting & Customization

Widths commonly offered from 1–500 mm and custom slitting; bulk lengths available by grade.

Custom formats: rolls, sheets, and die-cut dots/discs/shapes for automated or manual workflows.

Packaging and labeling options for procurement and line use.

Quality, Documentation & Traceability

For engineering approval and procurement, we can provide:

TDS and Application guidance.

Downloads

Download TDS (PDF)
View All Datasheets

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FAQ

Ready to qualify ESD Polyimide Tape on your line?

Request a quote or samples with your required thickness, width, roll format, and operating temperature profile. Our team will recommend the optimal grade and converting option for your application.

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